 Delkin Devices’ MMCplus card is relative to the size of a postage stamp, and is as thick as a credit card. This solid state storage solution features low power consumption and high data throughput. MMCplus and MMCmobile are based on Single Level Cell (SLC) NAND Flash. NAND Flash is non-volatile and retains the data without the need of a continuous power source.
Features
- Compliant with MultiMediaCard System Specification Version 4.1
- Non-volatile Solid State Memory
- Compliant with European Union Directive 2002/95/EC (RoHS)
- Three different data bus width modes: 1bit, 4bit and 8bit
- Supports Error Correcting Code (ECC)
- Supports Wear Leveling function to maximize data endurance
- MMC cards are available in Industrial and Industrial Extended Temperature operating ranges
- MMCplus capacities supported: 64MB, 128MB, 256MB, 512MB, 1GB and 2GB
- MMCmobile capacities supported: 128MB, 256MB, and 512MB
- MMCplus supports 2.7Volt to 3.6Volt operations
- MMCmobile supports 1.65Volt to 1.95Volt and 2.7Volt to 3.6Volt operations
- Built-in write protection features, which may be permanent or temporary
Specifications
Recommended Temperature Conditions
| Parameter |
Min. |
Max. |
| Storage Temp. |
-40°C |
85°C |
| Commercial Operating Temp. |
0°C |
55°C |
| Industrial Operating Temp. |
-10°C |
85°C |
| Industrial Extended Operating Temp. |
-25°C |
85°C |
Performance
| Parameter |
Value |
| *Data Transfer Rate |
up to 52 MB/sec |
Reliability
| Parameter |
Value |
| Cycle Endurance |
100,000 cycles min. |
Environmental Characteristics
| Parameter |
Value |
| Shock |
40g’s at 11ms, MIL-STD-810, Method 516.5 |
| Vibration |
15Hz to 2000Hz, MIL-STD-810, Method 514.5 |
| Humidity |
95% R-H, MIL-STD-810, Method 507.4 |
| Altitude |
80,000 ft |
| Durability |
10,000 mating cycles |
* - Dependant on configuration and testing environment
** - Reference DDEndurance.doc
Restriction of Hazardous Substances (RoHS)
These devices comply with all requirements of the European Union Directive 2002/95/EC (RoHS) and have been maintained in the manufacturing of this assembly. This assembly meets the following requirements:
| 1. Cadmium and Cadmium compounds |
threshold 0.01% of weight |
| 2. PBB and PBDE (halogenated flame retardant) |
threshold 0.1% of weight |
| 3. Mercury |
threshold 0.1% of weight |
| 4. Chromium (VI) |
threshold 0.1% of weight |
| 5. Lead and Lead compounds |
threshold 0.1% of weight |
This assembly meets the recommended maximum reflow temperature in accordance with IPC/JEDEC J-STD-020C.
Card Dimensions
| Table 1 - MMCplus Card |
Dimensions |
| Length: |
32 ± 0.1 mm (1.259 ±.004 in.) |
| Width: |
24 ± 0.08 mm (0.945 ±.004 in.) |
| Thickness Including Label Area: |
1.4 ± 0.1 mm (0.055 ± .004 in.) |
| Weight: |
2.0 g typical |
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