 Delkin’s Industrial and Extended Temperature CompactFlash memory cards feature significant performance upgrades for industrial applications. Vital tools such as wear-leveling, sustained write speed increases, write protection, shock and vibration strength, and temperature range extension are enabled and installed at our USA manufacturing plant as required before shipping. Delkin’s Industrial line of CompactFlash is the perfect solution for enterprises demanding specific higher qualitative and performance functions in a widely accepted, time-tested form factor.
Features
- Compliant with CompactFlash Specification Rev. 3.0
- Compliant with European Union Directive 2002/95/EC (RoHS)
- Operating modes – Memory, PCMCIA I/O, True IDE (PIO4 & DMA2)
- Capacities supported: 64MB, 128MB, 256MB, 512MB, 1GB, 2GB, 4GB and 8GB
- Available in Industrial and Extended Temperature operating ranges
- Solid State – no moving parts
- Tested mechanically to MIL-STD-810
- Ultrasonic welded case – No press fit components
- Supports 3.3-Volt and 5-Volt operation
- ECC and Wear Leveling
- Fixed Drive available
- Available upon request – Custom CIS, mechanical features, labels and packaging
Specifications
Recommended Temperature Conditions
| Parameter |
Min. |
Max. |
| Storage Temp. |
-65°C |
100°C |
| Commercial Operating Temp. |
0°C |
70°C |
| Industrial Operating Temp. |
-10°C |
85°C |
| Industrial Extended Operating Temp. |
-40°C |
85°C |
Performance
| Parameter |
Value |
| *Data Transfer Rate |
up to 16.6 MB/sec |
| *Sustained Read |
up to 10 MB/sec |
| *Sustained Write |
up to 9 MB/sec |
Reliability
| Parameter |
Value |
| **Cycle Endurance |
1,000,000 cycles min. |
| *MTBF |
>3,000,000 hrs |
| Data Retention |
10 Yrs |
Environmental Characteristics ***
| Parameter |
Value |
| Shock |
40g’s at 11ms, MIL-STD-810, Method 516.5 |
| Vibration |
15Hz to 2000Hz, MIL-STD-810, Method 514.5 |
| Humidity |
95% R-H, MIL-STD-810, Method 507.4 |
| Altitude |
80,000 ft |
Restriction of Hazardous Substances (RoHS)
These devices comply with all requirements of the European Union Directive 2002/95/EC (RoHS) and have been maintained in the manufacturing of this assembly. This assembly meets the following requirements:
| 1. Cadmium and Cadmium compounds |
threshold 0.01% of weight |
| 2. PBB and PBDE (halogenated flame retardant) |
threshold 0.1% of weight |
| 3. Mercury |
threshold 0.1% of weight |
| 4. Chromium (VI) |
threshold 0.1% of weight |
| 5. Lead and Lead compounds |
threshold 0.1% of weight |
This assembly meets the recommended maximum reflow temperature in accordance with IPC/JEDEC J-STD-020C.
Card Dimensions
| Length |
36.4 ± 0.15 mm (1.433 ±.006 in.) |
| Width |
42.80 ± 0.10 mm (1.685 ±.004 in.) |
| Thickness Including Label Area: |
3.3 mm ± 0.10 mm (.130 ± .004 in.) |
| Weight: |
12.0 g typical |
Specifications are subject to change at any time without notice
|
|
|
