Delkin Devices OEM, Rugged. Controlled Storage.

Featured Products

New Storage/Boot Drive


Free USB thumb drive

USB Embedded Module. Contact us with your project application and get a FREE 1GB USB thumb drive!

Industrial USB Embedded Module Overview

Delkin industrial secure digital

Delkin Device's USB Embedded Module is a solid state alternative to a hard disk drive, manufactured USB Embedded Module with extended temperature components, enhanced shock and vibration performance. Control of every aspect of each module is assured by a configurable part number and a locked down Bill Of Materials, minimizing unscheduled field inspections and product replacement.

The reduced design and engineering time required for USB Embedded Module assures optimum time to market. It supports USB Mass Storage function and may support USB boot function when supported in BIOS.

Combining USB and flash for embedded applications produces higher performance to support larger OS and heavier GUI applications. With over 20 years experience as an OEM partner providing storage solutions to manufacturers worldwide, Delkin Devices is the reliable USA manufacturer to fulfill your memory requirements. Rugged Controlled Storage-that is what makes Delkin Devices the right choice.

  • USB Mass Storage Compliant Device
  • USB 2.0
  • Single Layer Cell flash for higher performance and reliability
  • Higher shock and vibration tolerance than HDD
  • Lower power requirements than HDD
  • Available in the following capacities: 128MB, 256MB, 512MB, 1GB, 2GB, 4GB and 8 GB
  • Right angle or straight board orientation

Industrial temperature range
  Extended temperature range
 
Storage
-40° to 85° C
Storage
-40° to 85° C
Operating
-40° to 85° C
Operating
-40° to 85° C
Reliability    
MTBF: >2,000,000 hours
Data retention: 10 years
Endurance: 2,000,000 write/erase cycles
Environment    
Shock: 1,000G max
Vibration: 15G peak to peak max
Altitude: 80,000 feet

Register or Log in to download Delkin's full USB Embedded Module Product Documents and/or USB Embedded Module Engineering Specifications for more information.